CubeII

NegotiableUpdate on 02/14

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

I-CubeII Inverted Soldering Machine Hybrid Mounting Equipment [Universal Inverted Soldering Machine, Chip Soldering Machine] can mix SMD components and semiconductor components, corresponding to multi component supply, corresponding immersion and imprinting transfer device, corresponding to coating, can correspond to a wide range of L300mm × W200mm. Classification: Electronic Equipment, Inverted Soldering Machine Consulting Product i-CubeII Company Name: Location: Your Name: Email Address: Contact Phone: Inquiry Message: Verification Code P6JRULNC. Please enter the verification code displayed above to close

Product Details

Description

Specification

		i-CubeⅡ
Object size		L30×W30mm(Min)～L300×W200mm(Max)
Mounting accuracy (Our company uses standard components for evaluation)	F-head specification	Absolute accuracy (μ+3 σ): ± 20 μ m, repeatability accuracy (3 σ): ± 12.5 μ m
	4M head specification	Absolute accuracy (μ+3 σ): ± 30 μ m, repeatability accuracy (3 σ): ± 20 μ m
Installation/spraying efficiency (Best conditions) ※ Excluding processing time)	4M head specification	0.5 seconds/CHIP (continuous suction)
	FF head specifications	0.8 seconds/CHIP (for belt and tray supply) 1.3 seconds/CHIP (for chip supply)
	FD head specifications	It varies depending on the process. Please consult separately.
Overall dimensions		L1,350xW1,408xH1,850mm

Please consult for detailed information.

Specifications and appearance are subject to change without prior notice.