YSi SP 3D high-speed solder paste printing inspection machine

NegotiableUpdate on 02/14

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

YSi SP 3D High speed Solder Paste Printing Inspection Machine is a "high-speed universal integrated mounting head" suitable for various inspections. It realizes high-precision and high-speed inspections such as 3D+2D inspection and resolution switching. It provides a detailed and rich M2M (Machine to Machine) solution. The rich SPC function can achieve multiple statistical processing. It is suitable for various product options. Category: Electronic equipment, inspection device. Product consultation. YSi SP 3D High speed Solder Paste Printing Inspection Machine. Company name: Region: Your name: Email address: Contact phone number: Inquiry message: Verification code AXT3RMIL. Please enter the verification code displayed above to close

Product Details

Description

Specification

	YSi-SP
Object substrate size	L510mm × W460mm~L50mm × W50mm (monorail model) ※ Non double track models
Horizontal resolution (FOV size)	1) 25 μ m/12.5 μ m (approximately 50 × 50mm) 2) 20 μ m/10 μ m (approximately 40 × 40mm) 3) 15 μ m/7.5 μ m (approximately 30 × 30mm) ※ All are standard selection options
High resolution	1µm
inspection items	Solder paste printing status (volume, height, area, position offset)
Power Specifications	Single phase AC 200/208/220/230/240V ± 10% 50/60Hz
Supply gas source	No need for air
Dimensions (excluding protrusions)	L904×W1,080×H1,478mm
Main body weight	About 550kg

Specifications and appearance are subject to change without prior notice.