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main@protechnic.com.hk sales@protechnic.com.hk
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Room 3808, Tower 2, New Metropolis Plaza, 223 Hing Fong Road, Kwai Chung, Hong Kong
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Baoli Machinery Co., Ltd
YSB55w
NegotiableUpdate on 02/14
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Overview
YSB55w achieves about 3 times higher productivity and about 2 times higher precision mounting than previous models. Launching a 'semiconductor assembly revolution' in the expanding flip chip market. Can simultaneously adsorb 8 components at high speed and perform high-speed immersion welding, achieving a mounting capacity of 13000UPH with high precision ± 5 µ m (3 σ). High quality and strong universality. Classification: Electronic equipment, flip chip welding machine. Consulting product YSB55w. Company name: Location: Your name: Email address: Contact phone number: Inquiry message: Verification code X8GEOZCZ. Please enter the verification code displayed above to close
Product Details
Description
Specification
| YSB55w | |||
|---|---|---|---|
| Object substrate | L240×W200～L50×W50mm | ||
| substrate thickness | 0.2～3.0mm | ||
| Transport Direction | Left to Right (Optional: Right to Left) | ||
| Mounting accuracy | ±5µm（3σ） | ||
| Mounting ability | 13000 UPH (under optimal conditions including actual production processing time) | ||
| Supply form of parts | 12 inch chip | ||
| Object components | □2～30mm | ||
| Power Specifications | Three phase AC 200/208/220/240/380/400/416V ± 10% 50/60Hz | ||
| Supply gas source | Above 0.45Mpa | ||
| Overall dimensions | L2090 × D1866 × H1550mm (when equipped with a chip supply device) | ||
| weight | About 3500kg (when equipped with a chip supply device) | ||
- Specifications and appearance are subject to change without prior notice.
