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Guangyan Technology Co., Ltd
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Guangyan Technology Co., Ltd

  • E-mail

    qeservice@enli.com.tw

  • Phone

    18512186724

  • Address

    Room 6C, Building 3, No. 100, Lane 1505, Zuchongzhi Road, Pudong New Area, Shanghai

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Price of optical sensor wafer tester

NegotiableUpdate on 01/16
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Overview

SG-O is a CIS/ALS/Light Sensor wafer tester that combines a highly uniform light source and a semi-automatic wafer detector. A highly uniform light source can provide a continuous white light spectrum from 400nm to 1700nm, as well as monochromatic light output with a certain FWHM at many different wavelengths. The detector can handle it. 200mm wafer size and single chip size greater than 1cm x 1cm. SG-O integrates an ultra-low noise thermal chuck that provides a temperature range of -60 ° C to 180 ° C

Product Details

feature



Highly uniform light source

  • Wide spectral range from UV to SWIR

  • The height uniformity of the area exceeding 50mm x 50mm exceeds 98%

  • Ultra stable light intensity, able to maintain instability<0.2% for more than 10 hours

  • High intensity dynamic range, up to 140dB

Programmable automatic detector

  • 200mm~10mm wafer or chip processing capability

  • Used for accurate and reliable DC/CV, RF measurements

  • Stable functional microscope system

  • Integrate hardware control panel

  • Automatic wafer loader

  • Intelligent wafer mapping

Wide temperature and low noise chuck

  • Modular chuck

  • -Wide temperature range from 80 ° C to 180 ° C

  • Excellent CDA thermal control technology, high slope rate and high T stability

  • Ultra low noise for precise CIS/ALS/optical sensor wafer testing

application


  • CIS/ALS/Optical Sensor Wafer Testing

  • CIS/ALS/Optical Sensor Wafer Mapping and Yield Inspection

  • ToF sensor testing

  • Lidar sensor testing

  • InGaAs PD testing

  • SPAD sensor testing

  • Optical sensor simulation parameter testing:

    1. quantum efficiency

    2. spectral response

    3. System gain

    4. sensitivity

    5. dynamic range

    6. Dark current/noise

    7. signal-to-noise ratio

    8. Saturated capacity

    9. Linear Error (LE)

    10. DCNU (dark current non-uniformity)

    11. PRNU (Light Response Non Uniformity)

System Design


SG-O CIS/ALS/Light Sensor Tester (wafer level) system diagram. The highly uniform light source is controlled by PC-1. The light output is guided by optical fibers to an optical homogenizer to generate a uniform beam of light. The microscope and homogenizer are controlled by the automatic translation stage of PC-1 to switch positions and functions. The Probe system is MPI TS2000, controlled by PC-2. The position of the chuck table is also controlled by PC-2. The temperature of the hot card can be controlled between -55 ℃ and 180 ℃, covering most of the IC testing temperature range. The light intensity is detected and calibrated by a Si photodetector and an InGaAs photodetector using a picoampere ammeter.

Specifications


SG-O provides complete specifications for all the content you need in CIS/ALS/optical sensor wafer testing. The following are the main components and their detailed information. If you need more detailed information, please feel free to contact us at any time!

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Highly uniform light source

  • Spectral range: 400nm to 1700nm

  • Color temperature: 3000K to 5200K

  • Uniform illumination area: 42mm x 25mm, working distance>200mm

  • Illumination uniformity: better than 98%

  • Short term photostability: ≤ 1% for over 1 hour

  • Long term photostability: ≤ 1% for more than 10 hours

  • DUT and Zuithe latterWorking distance between optical components: ≥ 200mm

  • Monochromatic light generation:

  1. 10nm FWHM center wavelength:420nm,450nm,490nm,510nm,550nm,570nm,620nm,670nm,680nm,710nm, 780nm, 870nm

  2. 25nm FWHM center wavelength:1010nm,1250nm,1450nm

  3. 45 ± 5nm FWHM center wavelength： 815nm

  4. Center wavelength of 50nm FWHM:1600nm

  5. 60 ± 5nm FWHM center wavelength:650nm

  6. Center wavelength of 70 ± 5nm FWHM:485nm,555nm

  7. Center wavelength of 100 ± 5nm FWHM:1600nm

    • Out of band transmittance ≤ 0.01%

    • Peak transmission in bandpass area ≥ 80%

    • Center wavelength tolerance: (a) ≤± 2nm; (b)~(g) ≤± 5nm

    • FWHM tolerance: (a) ≤± 2nm; (b)~(g) ≤± 5nm

  • Variable attenuator: PC controlled 3D resolution, at least 1000 steps

Semi automatic wafer probe

  • Wafer size capability: 200mm, 150mm, 100mm wafers and single chips larger than 1cm x 1cm in size

  • Wafer processing: single wafer, manual feeding type

  • Semi automated: One step manual alignment teaching and automatic mold stepping

  • XYZ 平台

  • Chuck XY stage stroke: 210mm x 300mm

  • Chuck XY platform resolution: better than 0.5um

  • Collet XY platform accuracy: better than 2.0um

  • Chuck XY platform speed: slowest: 10 microns/second, zuiquick: 50 millimeters per second

  • Chuck Z stage travel: 50mm

  • Chuck Z platform resolution: 0.2um

  • Chuck Z platform accuracy: ± 2.0um

  • Theta platform

  • Theta stage travel: ± 5 degrees range of motion

  • Theta resolution: better than 0.01 degrees

  • Theta accuracy: 0.1 degrees

  • chuck

  • Chuck flatness ≤ 10um

  • Chuck hot operation: -60 ° C to 200 ° C

  • Chuck leakage at 25 ° C: ≤ 20fA per voltage under 10V bias at 25 ° C

  • Remaining capacitance of chuck ≤ 95fF

  • probe card

  • Probe card size: 4.5 inches to 8 inches long

  • Gap between probe holder and pressure plate: ≥ 7.5mm

  • Micro chamber

  • EMI shielding: ≥ 30dB in the range of 1kHz to 1MHz

  • System communication noise: ≤ 5mVp-p

  • Micro locator

  • microscope

  • Isolation table

Spectral radiometer

  • Spectral range: 400nm to 1600nm

  • Wavelength resolution: increase step size from 400nm to 1000nm<1nm; increase step size from 1000nm to 1600nm<3.5nm

  • Calibration: NIST traceable calibration certificate

More specifications

SG-O integratedEnlitechAdvanced optical simulator technology and MPI automatic probe system.EnlitechProvide multiple optical options to meet users' requirements for CIS/ALS/optical sensor wafer testing, including wavelength range, light intensity, and uniform beam size. We have decades of experience in helping customers solve the challenges of CIS/ALS/optical sensor wafer testing and design changes. Please feel free to contact us for more detailed information. Our professional team will provide assistance to you!


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main manifestations


Operating software for SG-O system. For highly uniform light source control software, SG-O provides light source system control and light intensity measurement. Provides Labview function palettes, driver/DLL files for various optical components. The software controls the translation stage to facilitate illumination on the equipment of the parts. The integration of integrated links includes sending/receiving commands, such as chip stepping, chip alignment/probing, etc.

CIS/ALS/Light Sensor Chip Images from SG-O Microscope System

SG-O-CIS-wafer-level-tester-23_-wafer-and-probe-card-install.jpg

SG-O-CIS-wafer-level-tester-23_-wafer-and-probe-card.jpg


Installation diagram of probe card for CIS/ALS/Light Sensor wafer

Probe head image for CIS/ALS/optical sensor wafer inspection


The optical homogenizer of SG-O CIS wafer level tester

Optical simulation and performance of SG-O CIS wafer level tester optical homogenizer

Beam uniformity, tested for beam spot uniformity using 42mm x 25mm at 420nm, with an non-uniformity of 1% as shown in the diagram

Beam uniformity, beam spot size of 50mm x 50mm, non-uniformity of 1.43% as shown in the diagram

Monochromatic light intensity of different wavelengths, ranging from ultraviolet to near-infrared; The light intensity is measured by a Si radiometer, and the range of light intensity can be used for various CIS/ALS/light sensor testing diagrams

Monochromatic light intensity at different wavelengths from NIR to SWIR, measured by InGaAs radiometer as shown in the diagram

The highly uniform light source of SG-O has a super stable light engine, with short-term or long-term light intensity instability better than 0.2% across the entire wavelength range.

The diagram shows the short-term instability of light intensity tested under 420nm monochromatic light output. The light instability is monitored by a Si radiometer for 60 minutes, and the instability for 1 hour is 0.12%

The diagram shows the short-term instability of light intensity tested under 1250nm monochromatic light output. The light instability was monitored by a SInGaAs radiometer for 60 minutes, and the instability after 1 hour was 0.09%

Short term instability of light intensity was tested under 420nm monochromatic light output. The light instability was monitored by a Si radiometer for 10 hours, and the instability after 10 hours was 0.1% as shown in the diagram

Short term instability of light intensity was tested under 1250nm monochromatic light output. The light instability was monitored by a SInGaAs radiometer for 10 hours, and the 10 hour instability was 0.06% as shown in the diagram


The diagram shows the light intensity attenuator of the SG-O system, and the light output intensity can be controlled by a PC with a resolution of at least 1000 steps

Information manual for automatic detectors,SG-O CIS / ALS / Light-SensorThe wafer tester is integratedMPIProbe, more details can be found inMPIFound on the website

data source MPI


The SG-O probe system is equipped with an automatic single-chip loader. Easy to load CIS/ALS/Light Sensor wafers. Loading and unloading wafers is direct and intuitive for users. The front of the feeding room also integrates a temperature control panel for easy operation.

The SG-O CIS/ALS/Light Sensor wafer tester also has a manual loading function, which can manually load wafers from the front door. The front door has a safety management function that can automatically monitor the temperature of the chuck and prevent the door from opening during testing to protect the safety of CIS/ALS/Light Sensor wafers and users.

The thermal chuck of SG-O CIS/ALS/Light Sensor wafer tester is temperature controlled by the CDA system minimized by ERS, which is more efficient than before. The temperature range can cover -80 ° C to 180 ° C (depending on ERA's model). Nitrogen purging can be carried out by using a separate valve. For CIS/ALS/optical sensor wafer testing, the target temperature rise rate and stability are excellent, and can be used in any







Under certain conditions (such as space).


The probe card size capability can range from 4.5 inches to 8 inches in length, as shown in the figure for DUT and SG-O high uniformity light sourcethe latterThe working distance of an optical component exceeds 200mm

The probe card size capability can range from 4.5 inches to 8 inches in length, as shown in the figure for DUT and SG-O high uniformity light sourcethe latterThe working distance of an optical component exceeds 200mm



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