JHPI-20 board

　　
High temperature resistant polyimide super engineering plastics have many excellent properties that other engineering plastics do not have: high temperature resistance, low temperature resistance, corrosion resistance, self-lubricating, low wear, excellent mechanical properties, good dimensional stability, low coefficient of thermal expansion, high insulation, low thermal conductivity, non melting, non rusting, and can replace metals, ceramics, polytetrafluoroethylene, and engineering plastics in many cases. They are widely used in the fields of petrochemicals, mining machinery, precision machinery, automotive industry, microelectronics equipment, medical devices, etc., and have a good cost performance ratio. Widely used in aviation, aerospace, microelectronics, nanotechnology, liquid crystals, separation membranes, lasers and other fields.

Components with low friction coefficient and wear resistance under high-speed and high-pressure conditions

Components with excellent resistance to creep or plastic deformation

Components with excellent self-lubricating or oil lubrication performance

Liquid sealing components under high temperature and high pressure

Components with high resistance to bending, stretching, and impact

Corrosion resistant, radiation resistant, and rust resistant components

Components with long-term use temperature exceeding 300 ℃ and short-term use temperature reaching 400-450 ℃

Typical applications include:

(1) Components with low friction coefficient and wear resistance under high speed and high pressure;

(2) Components with excellent resistance to creep or plastic deformation;

(3) Components with excellent self-lubricating or oil lubrication performance;

(4) Liquid sealed components under high temperature and high pressure;

(5) Components with high resistance to bending, stretching, and impact;

(6) Components that are corrosion-resistant, radiation resistant, and rust resistant;

(7) Components with long-term use temperature exceeding 300 ℃ and short-term use temperature reaching 400-450 ℃;

(8) High temperature resistant (over 260 ℃) structural adhesives (for modified epoxy resins, modified phenolic resins, modified organic silicone adhesives, etc. with a temperature resistance not exceeding 260 ℃);

(9) Used for microelectronic packaging, stress buffering protective coatings, interlayer insulation of multi-layer interconnect structures, dielectric films, chip surface passivation, etc.