Supplier of cold and hot shock test chamber

（1） Box structure:

2.1.1. Inner box material: Made of 1.2mm thick SUS304 # stainless steel, which is cut and processed by high-precision CNC equipment and bent into shape. The joints are polished and polished using argon arc welding, creating a beautiful and elegant appearance.

2.1.2. Outer box material: Made of 1.2mm thick cold-rolled steel plate, which is cut and processed by high-precision CNC equipment and bent into shape. The joints are welded, polished and polished with argon arc welding, and then treated with high-temperature powder coating and baking paint to effectively prevent rust. The appearance is treated with baking paint.

2.1.3. Insulation material: A mixed insulation layer made of high-temperature resistant glass fiber cotton and polyurethane rigid foam adhesive, with obvious insulation effect.

2.1.4. Thermal insulation layer: Thickened insulation layer is used for thermal insulation in the high and low temperature zones, and epoxy resin board is used for thermal insulation in the connection plate of the basket moving hole.

Module chip cold and hot cycle impact test chamberIt is an experimental equipment specifically designed to test the reliability and durability of electronic modules, chips, and their components under temperature changes and thermal shock environments. With the development of electronic products towards higher performance and smaller size, the reliability of electronic modules and chips under various working conditions has become particularly important. Therefore, it is necessary to conduct cold and hot cycle impact tests to ensure their stable operation in practical applications.

Main functions and features of the test chamber：

1. Simulate a cold and hot shock environment：

• The test chamber simulates the potential issues that chips and electronic modules may encounter during actual use through precise temperature control and rate of changeTemperature shockThis includes rapid transition from high temperature to low temperature (thermal cycling shock) and sharp fluctuations in temperature.

• The experimental process can simulate the actual working environment of the chip in electronic devices or systems, such as the operation in low-temperature or high-temperature environments during startup.

2. Temperature range and rate of change：

• The chip cold and hot cycle impact test chamber usually has a wide temperature control range, commonly ranging from * * -40 ° C to+150 ° C * *, and the equipment can reach * * -70 ° C to+180 ° C * *, which can meet the testing needs of various chips and modules.

• The rate of temperature change is usually within5 ° C/min to 20 ° C/minDuring the testing process, the rapid temperature changes simulate the environmental changes that may occur in practical applications.

3. Cold and hot cycle function：

• This test chamber is capable of conductingCold and hot cycle testBy periodically changing the temperature, simulate the repeated hot and cold alternation of the device in a real environment. The number and duration of cold and hot cycles can be adjusted according to testing requirements, usually ranging from tens to hundreds of cycles.

• Each cycle includesHigh temperature stage, low temperature stage, and cooling/heating processSimulate from oneTemperature to anotherEnvironmental changes in temperature.

4. Accurate temperature control and uniformity：

• A high-precision temperature control system is a major feature of the test chamber, which typically requires temperature fluctuations within a certain rangeWithin ± 0.5 ° CEnsure the stability and reproducibility of the experimental conditions.

• The temperature uniformity inside the test chamber is very important to ensure that the temperature is evenly distributed throughout the entire testing space and to avoid local temperature differences affecting the test results.

5. Humidity control (optional)：

• Some test chambers may be equipped withHumidity control systemUsed to simulate testing conditions in humid environments, especially suitable for stability testing of chips or modules in humid environments. The humidity range is usually20% RH to 98% RH.

6. Automated control and data recording：

• The chip cold and hot cycle impact test chamber is usually equipped withAutomated control systemIt can be operated through touch screen, PC or remote control system to set parameters such as temperature, time, cycle times, etc.

• The device also supportsData recording and real-time monitoringIt can automatically record temperature, humidity changes, testing time and other information for each testing cycle, providing support for subsequent analysis and reporting.

7. Security protection design：

• In order to ensure the safety of the testing process, the testing chamber is usually equipped withOver temperature protection to prevent equipment damageThe function. For example, when the device temperature exceeds the set range or malfunctions, the protection mechanism will automatically activate to avoid damage to the chip or module.

8. Diversified testing space：

• The internal space size of the test chamber can be customized according to different testing requirements, suitable for chips and electronic modules of various sizes. Different internal architecture designs can accommodate multiple module chips for simultaneous testing, or precise testing of a single chip.

Application field：

1. Electronic components and chip manufacturing：

• This test chamber is commonly used forElectronic components, chipsAnd reliability verification of other electronic modules, testing their stability under temperature changes. Chips and modules may experience loose solder joints, broken circuits, or internal structural damage due to thermal expansion and contraction when facing different temperature shocks. Therefore, it is necessary to verify their temperature resistance and reliability through cold and hot cycle impact tests.

2. Automotive Electronics：

• The chips and modules in the in car electronic system (such as engine control unit, in car computer, sensor module, etc.) need to cope with the working environment of the car under temperature changes. The cold and hot cycle impact test helps ensure that these electronic devices can function properly under high temperature, low temperature, and rapid temperature changes.

3. telecommunications industry：

• incommunication equipmentIn devices such as base stations, mobile phones, satellite communication equipment, etc., chips and electronic modules need to withstand long-term temperature changes, so it is very important to verify their performance and reliability through cold and hot cycle impact tests.

4. consumer electronics：

• Chips and modules in consumer electronic products such as smartphones, tablets, and laptops need to ensure stable operation in the environment. The cold and hot cycle impact test can effectively evaluate its working ability in alternating cold and hot environments, ensuring product quality.

5. aerospace：

• In the field of aerospace,Chips and electronic modulesReliable operation is required over a wide temperature range. The cold and hot cycle impact test can simulate the temperature difference encountered by equipment during high-altitude flight, ensuring that electronic devices can operate normally in the aerospace environment.

6. military equipment：

• JUN uses electronic devices such as radar, navigation systems, sensors, etc., which are often exposed to high temperatures and rapidly changing temperature differences. By conducting cold and hot cycle impact tests, it can be ensured that these devices will not fail in harsh environments.

summary：

Module chip cold and hot cycle impact test chamberIt is a professional equipment used to test the reliability and stability of electronic modules and chips under temperature conditions. It simulates the temperature changes (thermal shock) of chips and electronic modules in real working environments, helping to evaluate their long-term stability and performance under conditions such as temperature differences, thermal expansion, and thermal contraction. This device is widely used in fields such as electronic product manufacturing, automotive electronics, communication, consumer electronics, aerospace, and military, ensuring high reliability and stability of electronic components in various environments.