Quotation for Domestic Hast Aging Test Chamber

microelectronicsHast aging test chamberEquipment performance:

1．Inner box dimensions：300 × 450mm (φ × D) circular test chamber

2．outer box dimensions：660×950×600mm(W×H×D)

3．Inner box material：SUS304 # stainless steel plate material; The outer box isStainless steel orbaking paint、

4．temperature range：100 ℃~135 ℃ can be set arbitrarily、

5．humidity range：70~100%RH、(Steam humidity adjustable)

6．pressure range：0The0Kg/cm2~3、00Kg/cm2 for pressure; (Safe pressure capacity 3Kg/cm2/G=1 ambient atmospheric pressure+2Kg/cm2)

7．time range：0~1000H

8．temperature distribution：(+/-)2The0℃%（100℃）

9．warm-up time：RT~121 ℃ for about 35 minutes

10．pressurization time：0The0Kg/cm2~1、00Kg/cm2 within approximately 35 minutes

Hast aging test chambertechnical advantage：

Previously, temperature tests were calculated based on saturation of temperature and humidity, and the accuracy of steam pressure gauge calculations was insufficient. Now, a new technology is adopted, which displays the values of temperature, humidity, and pressure by reading the relevant sensors and conducting experiments.

2. Adopt a dry design and only use a point heat drying design during the experimental process to ensure the drying of the testing area or the test sample, and to ensure stable properties. Accurate pressure/temperature comparison display, meeting the requirements of the temperature, humidity, and pressure comparison table.

Hast aging test chamberNotes:

1. Reduce the structural hierarchy, and the hierarchical structure and its connection stiffness must comply with the second harmonic rule.

2. Modules and combinations closely related to electromechanical performance (such as antennas, waveguides, frequency synthesizers, printed boards, connectors, etc.), whose structural resonance or dynamic deformation must not cause a decrease or failure in telecommunications functionality and performance.

3. The selected electronic components must be able to adapt to the vibration and impact environmental conditions of the electronic device. Otherwise, stress screening or reinforcement must be carried out.

4. Avoid cantilever structures as much as possible.

5. Medium and large chassis and cabinets should adopt cast structures and welded structures as much as possible; Try to avoid using screw connection structures as much as possible.

6. Detachable or reversible connection structures must have reliable positioning clearance and locking devices, and the clearance between each joint surface should be eliminated to avoid additional impact, nonlinear self-excited oscillation, and mechanical structural noise.

microelectronicsHast aging test chamberReliability:

This formula is very imprecise. generally speakingIn practical use, there are many factors that reduce the inherent reliability A. However, if the product is used in a better environment and maintenance is strengthened, the reliability of the product can be greatly improved. In short, to improve the reliability of the product, the manufacturer must ensure the inherent reliability of the product. To ensure the inherent reliability of the product, it is necessary to carefully plan and organize all aspects from enterprise planning and contract signing to pre research, design, production, testing, inspection, review, etc., and organically integrate the entire process. At the same time, the production factory also needs to teach users the usage of the product. And users should also take appropriate measures to strengthen equipment management, enhance technical training for equipment users, etc., in order to improve the reliability of equipment use. Within the frequency range of vibration excitation, all hierarchical structures must not exhibit harmful structural resonance, that is, the structural resonance frequency must not be close to or coincide with the hazardous frequency of electronic equipment.