Modification of wafer debonding plasma etching machine

Plasma etching and deposition equipment

Shenzhen Shenguangda Technology Co., Ltd. has been deeply involved in the field of plasma technology for more than ten years and is a surface treatment solution service provider. The company's independently developed vacuum, atmospheric pressure, and microwave plasma cleaning equipment achieves precise cleaning and activation, with a continuous operation stability of over 99.6%, and has passed ISO 9001/14001 dual system certification. Its low-temperature vacuum plasma debonding machine * * achieves mass production processing of 300 wafers per hour in the semiconductor packaging process, with an etching uniformity error of less than 3%, helping customers increase their yield by more than 20%. For complex surfaces such as car interiors and medical catheters, the * * atmospheric pressure rotary spray gun system * * can complete 360 ° processing, and the surface tension value is steadily increased to over 72mN/m. We have achieved 7 × 24-hour uninterrupted operation in production lines of over 200 companies such as Foxconn and BYD, with equipment MTBF exceeding 8000 hours, redefining industrial cleaning standards with aviation quality.