ESIS 2026 7th China Electronic Semiconductor Digital Intelligence Summit

At present, the global semiconductor industry is moving from a "single point technological breakthrough" to a new stage of "system ecosystem collaboration". The technological evolution of the post Moore era combined with the application wave of AI big models has made chips no longer just hardware cores, but also a hub connecting the physical world and digital space, becoming an indispensable foundation for the digital economy. Under the strategic background of vigorously promoting new quality productivity in the country, how to use data to break through the bottlenecks of the industrial chain, and reconstruct the entire value chain of design, manufacturing, and testing with digitalization has become a key proposition for the industry to break through the situation.

In this context, guided by the Shanghai Integrated Circuit Industry Association, hosted by Information Hero, and co organized by the Zhejiang Digital Economy Federation, Huilian Zhihui, and YuanqiESIS 2026 7th China Electronic Semiconductor Digital Intelligence Summit, will be in 2026August 29InShanghaiConvene. This summit aims toSmart Energy Gathering and Core Drive TransformationAs the theme, we gathered over 220 industry representatives and shared more than 20 case studies to directly address industry pain points, clarify implementation paths, and jointly draw a blueprint for the digital development of the industry.

　　The summit focuses on three core issues:

　　Full chain interconnection, breaking down data barriers:In response to the challenges of industrial chain collaboration, we will explore the establishment of a unified industry data standard, connect the data links from EDA, IP, manufacturing to packaging and testing, solve the problems of information silos and inefficient collaboration, and build an efficient and interconnected industrial collaboration system.

　　AI deep cultivation, reshaping business scenarios:Returning to the essence of business, exploring real implementation cases of generative AI and intelligent computing power in chip verification, yield improvement, flexible production promotion, and supply chain management, refining practical methods for cost reduction, quality improvement, and efficiency enhancement, and exploring feasible paths for digital transformation.

　　Green intelligent manufacturing, building a resilient base:Focusing on low-carbon process upgrading, refined energy efficiency control, and green supply chain construction, we will promote the dual wheel drive of intelligent manufacturing and low-carbon transformation, and create a highly resilient and sustainable industrial chain supply chain system.

　　Core values of participation:

　　Correct wind direction:Deeply interpret the industrial planning orientation of the 15th Five Year Plan, analyze cutting-edge trends such as the integration of AI and chips, and heterogeneous integration of Chiplets, and seize development opportunities.

　　Benchmarking benchmark:Drawing on the practical experience of top enterprises, covering key areas such as industry chain data interoperability and joint verification of domestic devices, obtaining market tested solutions, and reducing the cost of transformation trial and error.

　　Link resources:Face to face communication with industry chain CEOs, CIOs, CTOs, and high-quality digital solution service providers to jointly build a domestic chip adaptation ecosystem and accelerate the process of independent and controllable development.

　　Clear Path:Sort out a digital roadmap suitable for your own enterprise, break through bottlenecks in the entire value chain, unleash production capacity potential, and use industry compliance guidance to steadily layout the global market.

　　1Basic information of the summit

　　Meeting Name:ESIS 2026 7th China Electronic Semiconductor Digital Intelligence Summit

　　Conference theme:Smart Energy Gathering · Core Drive Transformation

　　Meeting Time:August 29, 2026

　　Meeting location:Shanghai, China

　　Guidance unit:Shanghai Integrated Circuit Industry Association

　　OrganizerInformation Hero

　　Co-organizer:Zhejiang Digital Economy Federation

Co organizers: Huilian Zhihui, Yuanqi

　　IISummit Overview

　　01Participating enterprise ecosystem:Covering the core forces of electronic semiconductor digitization transformation

AI chip and high-performance computing solution provider, intelligent equipment and artificial robot supplier, advanced packaging and system integration service provider, semiconductor material and key component supplier, IBM enterprise and wafer foundry, digital transformation platform and industrial software service provider

　　02 Participant portraits:Focus on the core decision-making and implementation power of digitization

　　Strategic decision-making level (12%)CEO/VP/GM/Business Unit Leader - Develop enterprise digital transformation strategy, respond to global competition and supply chain restructuring, seize the opportunity of Shanghai Science and Technology Innovation Center construction and Yangtze River Delta integration development.

　　Technical decision-makers (35%)CTO/CIO/CDO/Vice President of R&D - Leading the layout of key technologies such as AI driven chip design, intelligent manufacturing platforms, and digital twin systems, promoting the deep integration of R&D and manufacturing processes

　　Digital implementation layer (38%)IT Director/AI Platform Director/Digital Twin Director/Intelligent Manufacturing Manager - Implement CIM/MES/ERP system, build industrial big data platform, promote intelligent transformation and automation upgrade of production lines

　　Business Operations Layer (13%)Intelligent Supply Chain Director/Green Manufacturing Director/Industry Ecological Cooperation Leader - Optimizing Capacity Collaboration and Supply Chain Resilience to Address Geopolitical Changes and Industrial Green and Service Transformation

　　Advanced packaging and integration experts (2%)Focusing on the research and industrial application of system level technologies such as Chiplets, 3D/3.3D packaging, heterogeneous integration, etc

　　03Geographical distribution of attendees:Yangtze River Delta as the core, radiating to the national innovation highland

　　IIIAgenda framework

　　01Opening Ceremony Forum：Gathering Energy and Breaking through Walls: AI Driven Organizational Restructuring and Strategic New Consensus in the Semiconductor Industry08:55-12:00

▣AI strategic perspective:From pilot to core - top-level design and roadmap of AI strategy for semiconductor enterprises

▣Organizational restructuring:The Organizational Form of Semiconductors in the AI Era: Integration of Platform based Organizations, Algorithm Teams, and Traditional Businesses

▣Talent reshaping:From "Chip Engineer" to "AI+Chip Engineer" - Selection, Cultivation, and Incentive of Composite Talents

▣Cultural change:Building a culture of "human-machine collaboration" - how to make engineers trust and make good use of AI tools?

▣AI computing power base:Unified AI Computing Platform for Large Models and EDA - Cloud Edge Collaboration and Heterogeneous Scheduling

▣Data assetization:AI ready data governance system - standardization and annotation mechanism for multi-source heterogeneous data

▣Zero trust security architecture:Full scenario identity security control for hybrid office and OT networks

▣Supply chain intelligence:From "Experience Prediction" to "AI Prediction" - The Role of Large Models in Supply and Demand Forecasting and Risk Warning

▣Green AI:AI optimization of energy consumption and carbon footprint - strategic value of intelligent algorithms in factory energy management

▣Overseas compliance:Cross border Compliance of Data under Global Operations: Multi branch Network Connectivity, Data Grading, and Privacy Implementation

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　　02Visit to the Smart Technology Exhibition Area&Buffet Lunch12:00-13:30

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　　03Theme Forum：Strong foundation and empowerment - AI and large model driven semiconductor full scene technology upgrade13:30-17:30

▣AI+EDA：The Engineering Implementation Path of Generative AI in Chip Design and Verification

▣Multimodal Large Model:Intelligent parsing and application of R&D documents, drawings, and unstructured data

▣Industrial Data Lake Warehouse:Unified storage, governance, and real-time analysis of multi-source heterogeneous data in semiconductors

▣Product lifecycle data:Data integration and configuration management optimization from research and development to mass production

▣AI visual inspection:Submicron level defect recognition - the latest progress of deep learning in wafer and packaging inspection

▣Intelligent document:OCR and large model processing of wafer acceptance and customs declaration forms

▣Digital Twin+AI:Data driven virtual wafer fab - from simulation optimization to real-time decision-making

▣Agile development application:Business driven rapid application construction and IT demand response acceleration

▣Knowledge Graph Platform:Analysis of Supply Chain Risk Transmission and Association Mining of R&D Knowledge

▣AI Security Fence:Intelligent monitoring and blocking scheme of large models in semiconductor code and IP leakage prevention

▣Edge AI:Deployment of Lightweight Models on the Machine Side - Real time Control and Low latency Reasoning

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　　04Appreciation Dinner 18:30-20:00

　　4Some of the previous big names

　　5Partial invited guests

　　VIPast Review

① On June 26th,ESIS 2026 6th China Electronic Semiconductor Digital Intelligence SummitIt was held grandly in Guangzhou. This summit is guided by the China Communications Engineering Association, hosted by Information Hero, and co organized by the Zhejiang Digital Economy Federation, Weilian Zhihui, and Yuanqi. It brings together 220+delegates and 120+professional guests, focusing on the transformation needs of the semiconductor industry in the Greater Bay Area, building an upstream and downstream communication platform, focusing on intelligent manufacturing, chip research and development, supply chain security, and global development, consolidating industry consensus, solving the pain points of digital transformation, strengthening industry chain collaboration, and helping to enhance the core competitiveness of the regional semiconductor industry.

On March 26, 2026,ESIS 2026 5th China Electronic Semiconductor Digital Intelligence SummitThe event was successfully held at the Shanghai Yangtze River Selected Hotel. This summit is themed "Digital Innovation in the Chip Industry and Intelligent Manufacturing", hosted by Information Hero and co organized by Zhejiang Digital Economy Federation and Huilian Zhihui. It brings together elite leaders in the fields of electronic semiconductors, intelligent manufacturing, digital technology, and explores new paths for industrial digitization transformation. The summit will set up two themed forums, focusing on industry hotspots and technological frontiers for in-depth discussions; Invite 19 industry experts to share their cutting-edge perspectives and practical experience on stage; 28 smart service providers set up an exhibition on site to showcase new technologies, products, and solutions. At the same time, one closed door private sharing event will be held to promote precise docking and deep cooperation; A matching thank-you dinner and 3 rounds of surprise lottery will enhance communication and build consensus in a relaxed atmosphere.

　　②ESIS 2025 4th China Electronic Semiconductor Digital Intelligence SummitOn May 24th, the grand finale came to a successful conclusion at the Shanghai Yangtze River Selected Hotel! Under the guidance of the Shanghai Integrated Circuit Industry Association, this conference is hosted by Information Hero and co organized by Zhejiang Digital Economy Federation, Huilian Zhihui, CIO Era, and Yuanqi Dingli. This summit has diverse forms of activities and frequent highlights: two themed forums are closely related to the digital transformation, with 17 guests conducting in-depth discussions on key technologies such as advanced processes and chip design, sharing industry trends and practical experience; 1 thank-you dinner to help industry elites facilitate cross-border cooperation intentions in a relaxed atmosphere; 19 digital service provider booths showcase cutting-edge achievements, becoming a "highway" for technology and demand docking.

　　③ESIS 2024 3rd China Electronic Semiconductor Digital Intelligence SummitSuccessfully concluded on December 19th at the Shanghai Marriott Hongqiao Hotel! This conference is guided by the Shanghai Integrated Circuit Industry Association, hosted by Information Hero, and co organized by the Zhejiang Digital Economy Federation, Zhongke Juli, and CIO Era. This conference will feature 2 forums, 1 award ceremony&thank-you dinner, 1 social lunch, and 1 closed door private event. In addition, 18 electronic semiconductor industry digital solution service providers will showcase their booths, and 20 senior experts from the industry will share disruptive innovations and practices in the digital transformation of the electronic semiconductor industry, comprehensively demonstrating the "chip" development trend of the electronic semiconductor industry and providing valuable opportunities for learning and communication for attendees.

　　④ESIS 2024 2nd China Electronic Semiconductor Digital Intelligence SummitSuccessfully concluded on May 24th at the Han Yue Ge Hotel in Yushan, Shanghai! This conference is guided by the China Communications Industry Association and the Shanghai Integrated Circuit Industry Association, hosted by Anhui Shenfu Business Consulting Co., Ltd. (Information Hero), and co organized by the Zhejiang Digital Economy Federation and Zhongke Juli. This conference will feature 3 forums, 1 roundtable dialogue, and 1 award ceremony&welcome dinner. More than 20 booths of digital solution service providers in the electronic semiconductor industry will be showcased, and 28 senior experts from the industry will share disruptive innovations and practices in the digital transformation of the electronic semiconductor industry.

　　⑤ESIS 2023 China Electronic Semiconductor Smart SummitSuccessfully concluded at the Shanghai Marriott Hongqiao Hotel in China! This conference is guided by the China Communications Industry Association, Shanghai Integrated Circuit Industry Association, Zhejiang Semiconductor Industry Association, and Jiangsu Semiconductor Industry Association, hosted by Information Hero, and supported by the Zhejiang Digital Economy Federation. This conference has set up 3 forums, 1 demonstration dinner, 27 exhibition booths, and 25 senior experts from the industry to share. The disruptive innovations and practices in the digital transformation of the semiconductor industry in various fields fully demonstrate the bridge and leading role of the industry exchange and cooperation platform. (Search for "Information Hero WeChat" on WeChat to learn more about the summit details)

　　7Registration Method