2026 China (Wuhan) International Semiconductor Industry and Electronic Technology Expo

Time:September 22-24, 2026Location: Wuhan International Expo Center

2026 Wuhan Electronic Components Exhibition, Wuhan Semiconductor Exhibition, Wuhan Electronic Materials Exhibition, Wuhan Electronic Technology Exhibition

　　Exhibition Overview

A good electronic technology expo in central China, a professional exhibition for electronic design, research and development, and manufacturing technology!

In recent years, thanks to the trend of industrial transformation and upgrading in China and the accelerated opening up of the central and western regions, electronic clusters have continued to rise in the central and western regions, and the electronic information industry has become a pillar industry in many provinces and cities in the region. After years of development, electronic industry bases have been formed in multiple regions including Hubei, Sichuan, Chongqing, Hunan, Anhui, Henan, and Xi'an. Significant progress has also been made in electronic research and manufacturing, with demand for mid to high end chips, components, materials, and electronic production equipment exceeding trillions.

In order to promote the leapfrog development of the electronic information industry in the central and western regions and promote the innovative application of advanced technology in the central and western regions, the 2026 China (Wuhan) International Semiconductor Industry and Electronic Technology Expo, hosted by Asia Pacific Ruisi Exhibition Service Co., Ltd., will be held at the Wuhan International Expo Center from September 22-24, 2026 as one of the characteristic exhibition areas of the 2026 China Machinery and Electronics Products Expo and Wuhan Industrial Expo. It will showcase integrated circuits, electronic components, sensors, connectors, wireless, power supplies, electronic materials, intelligent hardware, production equipment and industry solutions. At that time, the organizing committee will invite tens of thousands of professional engineers from domestic and foreign industries such as industrial electronics, automotive electronics, medical electronics, Internet of Things, consumer electronics, and communication to purchase and visit. In 2026, we look forward to meeting you in Wuhan and working together to explore new opportunities in the electronics industry

Background of the exhibition venue:

In 2017, the electronic information industry in Hubei Province achieved a main business revenue of 568.2 billion yuan, breaking through the 500 billion mark for the first time and increasing by 13.76% year-on-year, becoming another 500 billion yuan industry in Hubei Province besides automobiles. According to the Implementation Plan for Further Expanding and Upgrading Information Consumption in Hubei Province to Continuously Release Domestic Demand Potential, the electronic information industry will exceed 800 billion yuan within two years, and key core technologies will be in place for breakthroughs. Hubei strives to form a core competitive advantage through intelligent geographic information system (GIS) platforms, application software, and intelligent products that include chip design, packaging testing, material processing, and location services. In the fields of new display panels, 5G, broadband optical devices, laser communication light sources, industrial Internet, etc., breakthroughs or new progress should be made in "key core technologies". The relevant person in charge of the Provincial Department of Economy and Information Technology stated that our province is rapidly expanding its relevant layout. At present, the "National Information Optoelectronics Innovation" has initiated the establishment of the Optoelectronics Development Alliance, which covers more than 60% of the national level innovation carriers in the industry, and has broken through the 25G rate and below optoelectronic chip technology in about two years; The "National Digital Design and Production Innovation" has gathered numerous domestic school enterprise cooperation research projects and is becoming a gathering place for talents, skills, and capital.

　　Exhibition revenue

1. New Product Release and Innovative Product Awards: Together with national and global new products and technologies, it has attracted high attention from the automation manufacturing industry and participated in authoritative innovative product evaluations.

2. Directly connect with customers from various industrial manufacturing sectors: get in touch with enterprise decision-makers and R&D engineers.

3. Celebrity effect: Showcase and exchange technology with leading domestic and foreign industry manufacturers on the same stage.

4. Promotion: Provide large-scale and high-density strong promotion such as new product promotion, one-on-one interview special article promotion, Weibo and WeChat promotion, advertising promotion, etc., to expand more business opportunities.

5. Stereoscopic promotion: Integrate media resources to provide exhibitors with three-dimensional services from exhibition foresight, exhibition coverage, and post exhibition tracking.

6. Goal positioning: Strive to become an influential industrial manufacturing event with "industry concentration, industry leadership, and international advanced".

7. Pay attention to the growth of domestic independent innovation enterprises; Provide a platform for domestic growth enterprises to expand their international and domestic market channels.

8. Stereoscopic value-added services: The exhibition will serve exhibitors through exhibition foresight, media interviews during the exhibition period, and post exhibition media coverage.

The main contents showcased at the 2026 Wuhan Semiconductor Exhibition include:

10. IC products and technology: including the latest developments in integrated circuit design, manufacturing, packaging, and testing.

11. IC testing instruments: Display various instruments and equipment used for testing and verifying IC performance.

12. Design tools: software and hardware tools required in the IC design process.

13. Manufacturing and Packaging Technology: Innovative technologies covering semiconductor materials, equipment, and processes.

14. Innovative applications of PCB panels, multilayer boards, flexible boards, and other circuit boards: showcasing the latest trends in circuit board design and manufacturing.

The latest technological achievements in semiconductor packaging, cleaning, testing and other equipment reflect the technological innovations in the semiconductor production process.

16. Latest innovations in semiconductor optoelectronic devices and circuit board industry: showcasing the application of semiconductors in the optoelectronic field and circuit board industry.

17. Application technology of semiconductor special devices: Introduce the technical solutions of semiconductors in specific application fields.

　　exhibition scope

18. IC design, chips: IC and related electronic product design, artificial intelligence chips, power management chips, IoT chips

19. Communication chips and solutions, automotive electronic chips, security control chips, mixed signal communication RF chips, storage chips

20. LED lighting and display driver chips, etc;

21. Wafer Manufacturing and Packaging: Wafer Manufacturing, SiP Advanced Packaging OSATs、EMS、OEMs、IDM、 Silicon wafer and IC packaging

22. Loading boards, printed circuit boards, packaging substrates and equipment, assembly and testing, packaging design, testing, equipment and application manufacturing, etc

23. Manufacturing and sealing testing EDA、MCU、 Printed circuit boards, packaging substrates, semiconductor materials and equipment, etc;

24. Semiconductor materials: silicon wafers, silicon chips, photoresist, wafer tapes, photomasks, electronic gases, CMP polishing materials

25. Photoresist materials, wet electronic chemicals, sputtering targets, sealing materials, slicing, grinding, polishing, thin films, etc;

26. Third generation semiconductors: Third generation semiconductors such as silicon carbide (SiC), gallium nitride (GaN), wafers, substrates, packaging, testing, optoelectronics

27. Devices, including light-emitting diodes (LEDs), laser diodes (LDs), and ultraviolet detectors, as well as power electronic devices such as diodes and MOSFETs

28. JFET, BJT, IGBT, GTO, ETO, SBD, HEMT, etc., microwave RF devices (HEMT, MMIC), etc;

29. Semiconductor equipment: thinning machine, single crystal furnace, grinding machine, heat treatment equipment, lithography machine, etching machine, ion implantation equipment

30. CVD/PVD equipment, cleaning equipment, cutting machines, mounting machines, bonding machines, testing machines, sorting machines, probe stations, etc

31. Electronic components: basic components such as resistors, capacitors, potentiometers, electronic tubes, heat sinks, etc; Connectors, Semiconductor Discretes

32. Specialized components such as devices, electroacoustic devices, and laser devices; Surface mount components, diodes, transistors, and other devices meet the requirements of product thinning and lightweight

Advanced components with high frequency and high power requirements; Passive components, component distribution, relays, micro nano systems, sensor technology

34. Techniques, electromagnetic compatibility, power modules, and power supply units;

lSchedule

Exhibition time: September 20-21, 2026 (9:00-16:30)

Opening time: September 22, 2026 (9:30)

Exhibition time: September 22-24, 2026 (9:00-16:30)

Closing time: September 24, 2026 (14:00)

lcharging standard

l1、 Exhibition fees

　　
l2、 On site advertising (advertising expenses need to be settled in one lump sum)

Part of the advertising space inside and outside the exhibition area is open to exhibitors during the exhibition period, and orders are welcome.

　　
Participation Procedures

1. Exhibitors are required to fill out the "Exhibition Application Form" in detail, affix the official seal, and fax or send it to the organizing committee of the conference.

Within 5 working days after registration, the enterprise shall transfer the exhibition fee to the designated account of the conference organizing committee to determine the booth.

3. The exhibition booths, advertisements, etc. will be arranged by the organizing committee in a unified manner, with "first application, first payment, first allocation". Co organizers can give priority to arrangements.

4. Special reminder: Renting or reselling the booth is strictly prohibited. It is not allowed to display counterfeit and infringing products, as well as retail exhibits or sell other goods on site in the exhibition hall. Once discovered, the organizing committee will cancel the participation qualification and the booth fee will not be refunded. Do not stack items in the passage

　　Congress Organizing Committee

Wuhan Huazhong Youyou International Exhibition Co., Ltd

Conference Organizing Committee: Manager Xu

Tel: 18515881594 (same WeChat account)

QQ: 630581471 邮箱: 630581471@qq.com

The booth reservation for 2026 is currently in full swing. Book your booth now and seize the opportunity to meet you at the Wuhan International Expo Center from September 22-24, 2026. See you soon.