Domestic plasma cleaning machine supplier

This modelQuartz vacuum plasma cleaning machinepossessspecialThe quartz chamber design has excellent sealing performance, effectively preventing gas leakage and improving equipment safety. Its 13.56MHz RF plasma generator can generate high-density plasma, which can penetrate into the tiny structures on the surface of the product, ensuring outstanding cleaning and treatment effects. In addition, this efficient plasma treatment also helps to improve the performance of small products in experimental testing, meeting the stringent requirements for high-precision and high-purity surface treatment in scientific research and industrial fields.

1、 Principle: How can plasma achieve efficient cleaning?

The quartz vacuum plasma cleaning machine uses physical bombardment and chemical reactions of plasma to clean, activate, and modify material surfaces in a vacuum environment, suitable for high-precision fields such as semiconductors, optical devices, medical implants, etc.

1. Plasma generation mechanism

Vacuum environment: evacuate the reaction chamber to a low vacuum (10 ° C~10 ° C Torr) to reduce gas molecule collision interference.

High frequency electric field excitation: Inert gases (such as Ar) or reactive gases (such as O?, CF?) are excited by a radio frequency power source (usually 13.56 MHz)? ）Ionization produces a plasma containing ions, electrons, and free radicals.

Advantages of quartz chamber: Quartz is resistant to high temperatures and corrosion, ensuring plasma stability and avoiding metal contamination.

2. Principle of cleaning action

Physical sputtering: High energy ions bombard the surface, directly stripping away organic matter and particulate pollutants.

Chemical reaction: reactive free radicals (such as O?, F?)? ）Reacts with pollutants to generate volatile products (such as CO?, H?)? O) Discharge.

Surface activation: Plasma treatment can increase the surface energy of materials and improve subsequent coating or bonding properties.

2、 Operation process: Standardized steps from startup to cleaning

1. Equipment preparation

Check the sealing of the system: Confirm that there are no leaks in the chamber and pipelines, and that the vacuum pump (such as rotary vane pump+molecular pump) is operating normally.

Gas preparation: Connect gas cylinders (such as Ar, O?)? ）Adjust the flow meter to the set value (usually 20-50 sccm).

Sample fixation: Place the sample to be cleaned on a quartz tray to avoid blocking the plasma coverage area.

2. Parameter settings

Vacuum degree: Draw to basic vacuum (<5 × 10??)?? torr=''>

RF power: Set according to the material type (50-300 W), excessive power may damage the sample.

Processing time: Conventional cleaning takes 5-30 minutes, while ultra-fine cleaning can be extended to 1 hour.

3. Start plasma

Introduce working gas: First, introduce Ar gas for pre cleaning, and then switch to reaction gas (such as O? To remove organic matter).

Ignite plasma: Turn on the RF power supply and adjust it to a stable glow discharge (visible uniform purple/blue glow to the naked eye) through an impedance matching device.

Process monitoring: Observe the vacuum degree and power reflectivity (must be<5%), and immediately stop the machine in case of abnormalities. <>

4. Ending and Sampling

Turn off gas and power: first stop the RF, then turn off the gas, and finally turn off the vacuum pump.

Breaking through the air and taking out the sample: Inject N? Into the chamber to atmospheric pressure, and wear dust-free gloves to take out the sample.

3、 Maintenance points: key to extending equipment lifespan

1. Daily maintenance

Cleaning of the cavity:

Wipe the inner wall of the quartz chamber with IPA every week to remove polymer deposits.

Stubborn pollution can be treated with oxygen plasma ashing (power 200 W, O? Flow rate of 30 sccm, processing time of 1 hour.

Vacuum pump maintenance:

Check the oil level of the rotary vane pump every month and replace it when the oil quality is turbid (it is recommended to change the oil every 500 hours).

Molecular pumps need to be regularly checked for bearing status to avoid jamming during high-speed operation.

2. Maintenance of key components

Quartz window/tray:

Avoid mechanical impact, use a soft cloth and deionized water for cleaning, and do not use hard brushes.

Check the transparency every six months, and replace it if there is fogging or cracking.

RF electrode:

Regularly sand the surface oxide layer of the electrode with sandpaper to ensure conductivity.

Check the insulation gasket between the electrode and the cavity, and replace it promptly if it ages or cracks.

3. Calibration and troubleshooting

Vacuum gauge calibration: Compare the standard vacuum gauge every quarter, and adjust if the error is greater than 10%.

Gas flowmeter calibration: Use soap film flowmeter calibration to ensure accuracy of ± 2%.

Common troubleshooting:

Plasma instability: Check gas purity (≥ 99.999%) and matching impedance.

Insufficient vacuum degree: Check for aging of the sealing ring, pump oil contamination, or valve leakage.

Poor cleaning effect: Adjust the gas ratio (such as Ar: O?)? =4: 1. Enhance oxidation reaction).

4、 Safety and Environmental Protection

Gas safety: O?, CF? Flammable/toxic gases must be equipped with leak alarms, and exhaust gases must be treated with a scrubber.

Radiation protection: Plasma generates ultraviolet radiation. Close the observation window during operation to avoid direct viewing.

Waste disposal: The waste liquid (such as IPA) after cleaning should be recycled according to hazardous chemical standards.

5、 Application scenario optimization

Semiconductor packaging: using Ar/O? The mixed gas removes the oxide layer on the solder pad and enhances the bonding strength. Pre treatment of optical coating: H-plasma reduction of surface to improve film adhesion.

　　Quartz vacuum plasma cleaning machineThis machine not only performs well but also has significant advantages in cost control. It allows users to complete high-quality surface treatment tasks within the appropriate budget, achieving cost-effective growth. The equipped visual touch screen makes the operation more intuitive, and the real-time monitoring function of process parameters allows users to adjust and optimize operation settings in real time, ensuring that the processing effect always meets expectations.

In addition, the device supports multiple process gases, including argon, oxygen, hydrogen, helium, and various fluorinated gases, to meet different processing requirements and process conditions. The high-precision gas flow monitoring system, combined with dual process gas configuration (argon and oxygen), achieves precise control of dual gas flow. Users can adjust the gas ratio according to their needs to achievepremiumThe processing effect. This flexible use of process gases, combined with precise flow control, further improves the applicability and processing quality of equipment, making it an ideal surface treatment solution for scientific research and industrial fields.

① Visual touch screen, real-time monitoring of process parameters.

② Supports various process gases, including argon, oxygen, hydrogen, helium, and fluorinated gases.

③ High precision gas flow monitoring system, dual process gas configuration (argon, oxygen), dual gas flow control, adjustable ratio.